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| TL(RH,RMH,SH,OH,YH)1102B(T10) TOSHIBA LED Lamps TLRH1102B(T10), TLRMH1102B(T10), TLSH1102B(T10), TLOH1102B(T10), TLYH1102B(T10) Panel Circuit Indicator * * * * * * * * * * Surface-mount devices 3.2 (L) x 2.8 (W) x 3.4 (H) mm 2.8mm Diameter Lens-top type InGaAP LEDs High luminous intensity Low drive current, high-intensity light emission Colors: red, orange, yellow Reflow soldering possible Applications: automotive use, message signboards, backlighting etc. Standard embossed tape packing: T10 (500/reel) 8-mm tape reel Unit: mm Color and Material Product Name TLRH1102B TLRMH1102B TLSH1102B TLOH1102B TLYH1102B Color Red Red Red Orange Yellow InGaAP Material JEDEC JEITA TOSHIBA Weight: 0.042 g (typ.) 4-3Q1 For part availability and ordering information please call Toll Free: 800.984.5337 Website: www.marktechopto.com | Email: info@marktechopto.com 1 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) Maximum Ratings (Ta = 25C) Product Name TLRH1102B TLRMH1102B TLSH1102B TLOH1102B TLYH1102B 50 4 115 -40~100 -40~100 Forward Current IF (mA) Please see Note 1 Reverse Voltage VR (V) Power Dissipation PD (mW) Operation Temperature Topr (C) Storage Temperature Tstg (C) Note 1: Forward current derating IF - Ta 80 IF (mA) Allowable forward current 60 40 20 0 0 20 40 60 80 100 120 Ambient temperature Ta (C)) Electrical Characteristics (Ta = 25C) Product Name Min TLRH1102B TLRMH1102B TLSH1102B TLOH1102B TLYH1102B Unit 1.6 1.6 1.6 1.6 1.6 Forward Voltage VF Typ. 1.9 1.9 1.9 2.0 2.0 V Max 2.3 2.3 2.3 2.3 2.3 mA A V 20 10 4 IF Reverse Current IR Max VR 2 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) Optical Characteristics-1 (Ta = 25C) Product Name TLRH1102B TLRMH1102B TLSH1102B TLOH1102B TLYH1102B Unit Luminous Intensity IV Min 160 160 400 400 250 mcd Typ. 400 480 850 950 700 mcd Max 1250 1250 3200 3200 2000 mcd IF 20 20 20 20 20 mA Available Iv rank Please see Note 2 SA / TA / UA / VA SA / TA / UA / VA UA / VA / WA / XA UA / VA / WA / XA TA / UA / VA / WA Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility. Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned. Luminous Intensity IV Min 160 250 400 630 1000 1600 mcd Max 320 500 800 1250 2000 3200 mcd Rank SA TA UA VA WA XA Unit Optical Characteristics-2 (Ta = 25C) Emission Spectrum Product Name Peak Emission Wavelength p Min Typ. Max Typ. 18 17 17 15 15 nm Dominant Wavelength d Min 624 620 607 599 581 Typ. 630 626 613 605 587 nm Max 638 634 621 613 595 mA 20 IF TLRH1102B TLRMH1102B TLSH1102B TLOH1102B TLYH1102B Unit 644 636 623 612 590 nm The cautions * * This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light. This product is designed as a general display light source usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (ex. Light source for sensor, optical communication and etc) except general display light source. 3 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) TLRH1102B IF - V F 100 (typ.) 1000 Ta = 25C IV - IF (mcd) (typ.) (mA) 500 300 30 IF 10 Luminous intensity Forward current IV 100 50 30 1 1.6 1.8 2.0 2.2 2.4 10 1 3 5 10 30 50 100 Forward voltage VF (V) Forward current IF (mA) 10 5 IV - Tc (typ.) 1.0 Wavelength characteristic (typ.) IV IF = 20 mA Ta = 25C Relative luminous intensity 0 25 50 75 100 0.8 Relative luminous intensity 3 0.6 1 0.5 0.3 0.4 0.2 0.1 -25 0 580 600 620 640 660 680 700 Case temperature Tc (C) Wavelength (nm) Radiation pattern Ta = 25C (typ.) 20 30 40 50 60 70 80 90 10 0 10 20 30 40 50 60 70 80 90 1.0 0 0.2 0.4 0.6 0.8 4 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) TLRMH1102B IF - V F 100 (typ.) 2000 Ta = 25C IV - IF (typ.) (mA) (mcd) IV Luminous intensity 1.8 2.0 2.2 2.4 1000 30 IF 500 300 Forward current 10 3 100 1 1.6 50 1 3 5 10 30 50 100 Forward voltage VF (V) Forward current IF (mA) IV - Tc 3 (typ.) Wavelength characteristic 1.0 IF = 20 mA Ta = 25C (typ.) IV Relative luminous intensity -20 0 20 40 60 80 Relative luminous intensity 0.8 1 0.6 0.5 0.3 0.4 0.2 0.1 0 580 600 620 640 660 680 700 Case temperature Tc (C) Wavelength (nm) Radiation pattern Ta = 25C (typ.) 10 0 10 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 1.0 0 0.2 0.4 0.6 0.8 5 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) TLSH1102B IF - V F 100 (typ.) 2000 IV - IF Ta = 25C 1000 (typ.) (mA) 30 IF IV (mcd) 500 300 10 3 Luminous intensity Forward current 100 1 1.6 1.8 2.0 2.2 2.4 50 1 3 5 10 30 50 100 Forward voltage VF (V) Forward current IF (mA) IV - Tc 10 (typ.) 1.0 Wavelength characteristic (typ.) IV 5 IF = 20 mA Ta = 25C Relative luminous intensity 0 25 50 75 100 0.8 Relative luminous intensity 3 0.6 1 0.5 0.3 0.4 0.2 0.1 -25 0 580 600 620 640 660 680 700 Case temperature Tc (C) Wavelength (nm) Radiation pattern Ta = 25C (typ.) 20 30 40 50 60 70 80 90 10 0 10 20 30 40 50 60 70 80 90 1.0 0 0.2 0.4 0.6 0.8 6 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) TLOH1102B IF - V F 100 (typ.) 2000 IV - IF (mcd) Ta = 25C 1000 (typ.) (mA) 30 IF IV 10 Luminous intensity 1.8 2.0 2.2 2.4 500 300 Forward current 3 100 1 1.6 50 1 3 5 10 30 50 100 Forward voltage VF (V) Forward current IF (mA) IV - Tc 10 (typ.) Wavelength characteristic 1.0 (typ.) IV Relative luminous intensity 5 3 IF = 20 mA Ta = 25C 0.8 Relative luminous intensity 0.6 1 0.5 0.3 0.4 0.2 1 -25 0 25 50 75 100 0 540 560 580 600 620 640 660 Case temperature Tc (C) Wavelength (nm) Radiation pattern Ta = 25C (typ.) 20 30 40 50 60 70 80 90 10 0 10 20 30 40 50 60 70 80 90 1.0 0 0.2 0.4 0.6 0.8 7 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) TLYH1102B IF - V F 100 (typ.) 2000 Ta = 25C IV - IF (typ.) (mcd) IV Luminous intensity 1.8 2.0 2.2 2.4 (mA) 1000 30 IF 500 300 Forward current 10 3 100 1 1.6 50 1 3 5 10 30 50 100 Forward voltage VF (V) Forward current IF (mA) IV - Tc 10 5 (typ.) 1.0 Wavelength characteristic (typ.) IV IF = 20 mA Ta = 25C Relative luminous intensity 0 25 50 75 100 Relative luminous intensity 3 0.8 0.6 1 0.5 0.3 0.4 0.2 0.1 -25 0 540 560 580 600 620 640 660 Case temperature Tc (C) Wavelength (nm) Radiation pattern Ta = 25C 10 0 20 30 40 50 60 70 80 90 10 20 30 40 50 60 70 80 90 1.0 0 0.2 0.4 0.6 0.8 8 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) Packaging These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions. Temperature: 5C~30C Humidity: 90% (max) 2. After the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an environment of 5C to 30C/60% RH or below. 3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60 5C, for 12 to 24 hours. Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label. 4. Repeated baking can cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be sure to prevent damage to the device from static electricity during the baking process. 5. Any breakage in the laminate packing material will cause the hermeticity of the product to deteriorate. Do not toss or drop the packed devices. Mounting Method Soldering * Reflow soldering Temperature profile (example) 10 s max (*) (*) 240C max Package surface temperature (C) 140~160C max (*) 4C/s max (*) 4C/s max(*) 60~120 s max (*) Time (s) * * * * * The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions. Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30C, 60% RH (max) Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron : 25 W Temperature : 300C or less Time : within 3 s Do not perform wave soldering. Recommended soldering pattern 1.65 1.15 1.65 2.41 Unit: mm 9 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) Cleaning When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. ASAHI CLEAN AK-225AES KAO CLEAN TROUGH 750H PINE ALPHA ST-100S TOSHIBA TECHNOCARE (FRW-17, FRW-1, FRV-100) : (made by ASAHI GLASS) : (made by KAO) : (made by ARAKAWA CHEMICAL) : (made by GE TOSHIBA SILICONES) Precautions When Mounting Do not apply force to plastic parts of the LED under high-temperature conditions. The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials. When installing the PCB in a product, ensure that the device does not come into contact with other components. Tape Specifications 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (This method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications.) (1) Tape Type: T10 (8-mm pitch) (2) Example TLRH1102B (T10) Tape type Toshiba product No. 2. Tape dimensions Unit: mm Symbol D E P0 t F D1 Dimension 1.5 1.75 4.0 0.3 5.5 1.5 Tolerance +0.1/-0 0.1 0.1 0.05 0.05 +0.1/-0 Symbol P2 W P A0 B0 K0 Dimension 2.0 12.0 8.0 2.9 3.7 3.6 Tolerance 0.05 0.3 0.1 0.1 0.1 0.1 P0 D P2 E F W t K0 B0 Polarity P A0 D1 10 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) 3. Reel dimensions Unit: mm 13.0 0.3 15.4 1.0 180 +0 -4 2 0.5 4. Leader and trailer sections of tape 40 mm or more (Note 1) 40 mm or more (Note 2) Leading part: 190 mm (min) 13 60 44 Note 1: Empty trailer section Note 2: Empty leader section 11 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) 5. Packing display (1) Packing quantity Reel Carton 500 pcs 2,000 pcs (2) Packing form: Each reel is sealed in an aluminum pack with silica gel. 6. Label format (1) Example: TLRH1102B (T10) P/N: TYPE ADDC TOSHIBA TLRH1102B (T10) Q'TY 32C 500 pcs 500 Lot Number Key code for TSB (RANK SYMBOL) Use under 5-30degC/60%RH within 168h [[G]]/RoHS COMPATIBLE *Y3804xxxxxxxxxxxxxxxxx* SEAL DATE: DIFFUSED IN ***** ASSEMBLED IN ***** (2) Label location * Reel * Carton Tape reel direction Label position Label position * The aluminum package in which the reel is supplied also has a copy of the label attached to the center of one side. 12 2006-07-07 TL(RH,RMH,SH,OH,YH)1102B(T10) RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 13 2006-07-07 |
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